Age restricted

Robnor Resins PX804C Epoxy Resin 500g

Code: N92HW

  • A good alternative to PX700K
  • High electrical insulating characteristics
  • Non-toxic
  • Purchasers must be over 18

Product details

Robnor Resins PX804C Epoxy Resin 500g

• A good alternative to PX700K• High electrical insulating characteristics• Non-toxic• Good thermal conductivity• Low shrinkage• High adhesion• Flame retardant to UL94-V0 @ 3mm• Good chemical and water resistance• Meets the requirements of WEEE and RoHS

This epoxy resin PX804C potting compound is a non-toxic general purpose flame retardant potting and encapsulating compound, it is a safer alternativve to the popular PX700 and can be used for the same applications.PX804C has a long usable life and may be hot or cold cured. The system exhibits good surface finish, high electrical strength, good thermal conductivity, low exotherm and low cure shrinkage. The semi-flexible nature allows thermal expansion without cured stress and this makes PX804C compatible with most circuit board components and materials over a wide temperature range. Adhesion is excellent to most plastics and substrates. The combination of properties and the ease of use of the material will lend itself to a wide range of applications. PX804C does not contain halogens or heavy metals. The finish colour is black.
Colour Black
Specific Gravity g/ml 1.7
Viscosity m.Pa @ 25° C 9000
RoHS compliant Yes
UL94-V0 Yes
REACH (SVHC concentration) 0%
Mix ratio by weight 8.6: 1
Mix ratio by volume 4.8: 1
Useable life ( 15 0g @ 25 °C ) 120 Minutes
Gel time (1 50 g @ 2 5° C) 360 minutes
Cure schedule Minimum cure Full cure
24 hrs @ 20 °C 1 week
2 hr s @ 6 0° C 4 hour s
1 hr @ 8 0° C 2 hours
Typical properties
Peak exotherm (1 50 g @ 2 5° C) 40
Shrinkage % ( volume) 0.3
Thermal conductivity 0.85 W/m K
Operating temperature range -5 5 to + 13 0° C
(application & geometry dependent)
Electric strength 18 kV/mm
Volume resistivity 11 Log 10 ohm -cm
Shore D hardness 80
Flammability UL94 -VO 3 mm
Tensile strength 50 mPa
Compressive strength 60 mPa
Deflection temperature 50°C
Co-efficient of expansion 35 -5 5 ppm/° C
Loss Tangent 0.060 @ 50Hz
Permittivity 4.8 @ 50 Hz
Continuous tracking ind ex >850 V
Water absorption 0.3% (30 d ays @ 20 °C )

I'm disappointed to see you couldn't answer my previous question which was ' to achieve a long cure time should the compound be warm or cold'. I don't think you would be helping with design if you answered question. Maybe I wasn't clear in my first post.

Asked by: Daveb
For a long cure, you would need to be using cold compound, I have linked the full datasheet below, which should hopefully cover any specifications you need:
Answered by: Russell
Date published: 2015-08-11

I want to encapsulate a small ignition coil. I envisage filling under vacuum to make sure It gets into the small spaces. I want long cure time. Should the compound be warm or cold to achieve this? comments please. 

Asked by: Daveb
It is important to note that as a retail only company we are unable to assist with any design projects or queries, or advise on specific products that may be required for your purpose.
Answered by: Dominic
Date published: 2017-01-27
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Bulk Prices

Item code Item name Quantity Price
N92HW Robnor Resins PX804C Epoxy Resin 500g (1+) £14.99

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