- Connect a variety of components without the need of soldering
- Interconnected rows and blocks
- Standard DIP sockets
- maximum wire supported 20 - 30 SWG (0.3 - 0.8 mm)
A range of solderless breadboard modules that can interconnect to suit individual requirements. The basic board AD-01 consists of four blocks of six columns of 28 rows, the sockets in each row being interconnected. The blocks are a standard DIP size apart, although MSI and LSI type chips can be used. At both ends of the blocks, there are two power busses. The ‘Red’ bus is made up of two separate rows of 12 connecting sockets, and the ‘Black’ bus is one row of 24 connecting sockets
There is an additional matrix of 30 by 6 sockets for non-dip type components. The six sockets in the vertical plane are interconnected. Each socket will accept solid wire from 20 to 30 swg (0•3 to 0•8mm). The base has a ‘sticky’ covering to hold the board firm on a workbench or surface.
AD-01 is 117 x 80mm