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Akasa AK-460 Silicone Thermal Compound Paste
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Quoting product code: A71FR
• Ensures efficient heat transfer between your CPU and heatsink, keeping your CPU cool
• Silicone based and not electrically conductive
• Thermal conductivity of 3.3W/mK provides great heat transfer
• Supplied with a spreader card to aid with applicationWhy would I need thermal compound paste?
This thermal compound helps to keep heat transfer between your CPU and heatsink as high as possible, so you can increase the longevity and possible performance of your CPU. It is manufactured from pro-grade silicone technology, which provides you with a great thermal conductivity rating of 3.3W/mK. This thermal compound won’t bleed under high pressure and even if it bleeds, since it is electrically non-conductive, you won’t have to worry about any getting onto your motherboard or other components.
PLEASE NOTE: By law we are not allowed to sell butane or solvent based products to persons under the age of 18
|Thermal Conductivity||3.3 W/mK|
|Thermal Resistance/Impedance||0.16 cm2 C/W @ 60um BLT|
|Operating Temperature||-45°C to 200°C|