• Improves heat transfer between your CPU and heatsink
• Nano silver based for instant conductivity
• Thermal conductivity of 4.5W/mK delivers fantastic heat transfer
• Supplied as a bottle for long term storage and provides multiple usesWhy would I need thermal compound paste?
This thermal compound helps to keep heat dissipation between your CPU and heat sink as high as possible, so you can increase the longevity and performance of your CPU. It has a thermal conductivity rating of 4.5W/mK, which delivers fantastic heat transfer. Since 10 percent of the thermal compound is silver based, you get instant conductivity, so you won’t have to wait long to experience the high heat transfer rates. Supplied in a bottle, it can easily be stored for long periods and allows for multiple applications.
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